Chip 3D size measuring instrument
AG Series Solution for 3D Dimensional Testing of Optical Communication Chip Packaging
AG Series, as the high-precision testing equipment for semiconductor chip packaging (SCP), mainly meets the testing requirements of length, width, and flatness of the shell during the front end packaging, the diameter, arc length, and arc height of the gold wire in the packaging process, and the spacing and width of the lead wires of the wire frame during the back end packaging
AG Series from TTE aims at high-precision and high-efficiency measurement of small and precise semiconductor-based products. Its design concept pursues simplicity, using an 8X or 13X object-space telecentric lens cone equipped with a 10X/0.3 high-resolution metallographic objective lens, to realize the need for precise and accurate measurement.
Model | AG200 | AG300 |
Measurement Range (mm) | 200*200*150 | 300*300*150 |
XY-axis Accuracy (μm) | 1.5+L/200 | 1.6+L/200 |
Z-axis Accuracy (μm) | 2.0+L/200 | 2.0+L/200 |
XY-axis Vector Accuracy (μm) | 2.0+L/200 | 2.5+L/20 |
Load Capacity | 25kg | |
Grating Ruler Resolution | 0.1μm metal skins grating ruler | |
Max Speed of XY-axis | 100mm/s | |
Max Acceleration of XY-axis | 600mm/s | |
Max Speed of Z-axis | 30mm/s | |
Optical Zoom | 0.6-5x auto zoom coaxial optical lens cone (1: 8) +10x metallographic objective lens | |
Optical Magnification | 183x | 1124x |
Image Device | 2MP HIKVISON (1/2) Gigabit color digital camera | |
Motion Device | Panasonic servo motor | |
Lighting Sources | Programmable adjustment: LED coaxial reflective light source/Parallel transmitted light source based on integrating sphere (white light) | |
Options | 5x, 20x metallographic objective lens/Air-float vibration isolator | |
