X Series Solution for 3D Dimensional Testing of Optical Communication Chip Packaging

X Series, as the high-precision testing equipment for semiconductor chip packaging (SCP), mainly meets the testing requirements of length, width, and flatness of the shell during the front end packaging, the diameter, arc length, and arc height of the gold wire in the packaging process, and the spacing and width of the lead wires of the wire frame during the back end packaging

X Series from TTE aims at high-precision and high-efficiency measurement of small and precise semiconductor-based products. Its design concept pursues simplicity, using an 8X or 13X object-space telecentric lens cone equipped with a 10X/0.3 high-resolution metallographic objective lens, to realize the need for precise and accurate measurement.